IREM-I

The IREM-I is the global semiconductor industry's first HgCdTe (MCT) IR emission microscope. Introduced by Infrared Laboratories in 1996, IREM-I has the largest installed base of infrared backside systems in the industry. The IREM-I detector and optics are designed for both photoemission applications in the 1 µm to 1.5 µm wavelength range, and thermal emission in the 1.5 µm to 2.5 µm wavelength range. IREM-I utilizes proprietary cryogenic and optical components originally developed, with support from NASA, for the Hubble Space Telescope and later used in the IREM product line for backside (through the substrate) design debug and failure analysis.  These components provide optimal performance for an MCT-based system.

IREM-I utilizes advanced software features ported from applications in astronomy to enable fault localization beyond the diffraction limits of the optical system. In addition, enhanced spatial resolution ensures the best identification of faulty emission sites.

IREM-I Applications

Back or Front side "Hot Carrier" Emission Detection and Imaging

Emission microscopy is a powerful FA tool. The intensity of a great majority of emission mechanisms is known to increase in the IR region (beyond 1 micron). The IREM1 utilizes an Infrared Focal Plane Array with a spectral response from 0.8 up to 2.5 microns. This allows the tool to have higher sensitivity than a traditionally used CCD camera which has a spectral response from 0.2 to approximately 1.1 microns. The difference in sensitivity becomes even more dramatic for backside FA, since silicon becomes transparent at 1.07 microns. Given the integration time, one can expecct to detect at least 10 times lower currents through a p-n junction in a backsie measurement with case studies of 100 - 1000 times improvement in signal -to-noise.

"Hot spot" Thermal Detection and Imaging

The unique spectral range of the IREM1 allows detection of not only "hot carrier" emission but also heat generated by currents passing through resistance. Proprietary acquisition techniques can localize a thermal 'hot spot' to 5 microns. This provides a safe, sensitivie and fast alternative to using liquid crystals. The technique has been successfully used with frontside and backside samples.

Thermal Mapping

The IREM1 can be used to create thermal maps of different ICs. This method allows one to obtain an image that shows the temperature distribution on the surface of the die. A special setup with a thermal chuck is required for calibration. The sensitivity of the camera has been measured to 10mK. This makes the IREM1 a suitable replacement to liquid crystal.